IPC/JEDEC J-STDC. Handling, Packing,. Shipping and Use of. Moisture/ Reflow. Sensitive Surface. Mount Devices. A joint standard. IPC/JEDEC J-STDC-1 -. August IPC/JEDEC J-STDC -. February IPC/JEDEC J-STDB.1 includes Amendment 1 -. complies with ipc/JEDEc J-stDA. 3M™ HIC this card meets the IPC /JEDEC J-STD-. A standard. card size: 2” x 3” inches indicates: 5,10,15%.
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Board assemblers have focused on handling more expensive ICs but have failed to take similar precautions with board connectors. Blister onset temperature is dependent upon several factors, including wall thickness, percentage of moisture in the part, speed of connector heating, and peak temperature of the reflow process. Effectiveness of desiccant on moisture absorption of packaged connectors.
This standard is not included in any packages. Many Asian OEMs, who have been converting to the lead-free solder process for the last few years, require that their connectors be packaged to minimize moisture absorption for this reason. The key parameter in blistering of connector housings is the control of moisture absorption in the molded parts.
IPC/JEDEC J-STDB | In Compliance Magazine
For standard MBB sizes used for shipping connectors loose or on reels the amount of desiccant required is less than two units. Some materials currently used may deform melt or show signs of delamination on the side walls, referred to as “blistering. Table 3 shows that, at the storage conditions of an air-conditioned warehouse in Southeast Asia Condition 1even the thinnest tested LDPE bag would provide enough moisture protection to keep the connectors below the blister threshold level for 90 days.
By using these procedures, safe and damage-free reflow can be achieved with the dry packing process, providing a minimum shelf life of 12 months from the seal date when using sealed dry bags.
We have no amendments or corrections for this standard. But the problems listed previously for connectors in these hot oven environments can also result in board rework. Approved options include clay and silica gel.
Subscription pricing is determined by: MBBs in two different thicknesses 0. Lead-free solders result in higher peak temperatures, meaning more blistering.
In this stage, the higher liquidus temperatures required for lead-free solders may have a profound effect on the connector insulator housings. The higher the peak temperature, the lower the moisture content can be before blistering.
This standard is also available to be included in Standards Subscriptions.
Many connector suppliers are eliminating, or have already eliminated, lead from their contact plating process. Key to elimination of blistering is moisture control for most of the temperature-capable engineering resins used in connector housings.
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The company compared three moisture measurement techniques: You can download and upc this file to your own computer but DRM prevents opening this file on another computer, including a networked server.
J-STD Bake Conditions
You may delete a document from your Alert Profile at any time. Figures 1 and 2. The higher preheat temperatures typical in lead-free solder profiles may provide more safety from blistering for thinner-walled parts than current tin-lead solder profiles due to the direct relationship between moisture desorption rate and temperature. The next phase will be lead-free solder compliance for board assembly.
The vapor pressure of moisture and other gases trapped inside the walls of a plastic connector increase rapidly when the connector is exposed to the high temperatures of solder reflow. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation.
BoxEvansville, IN; Fax: Higher temperatures required for lead-free SMT soldering will force a change from many currently used connector housing resins, which will melt, suffer pin retention failures or fail to meet dimensional stability requirements.
If the document is revised or amended, you will be notified by email. If all moisture absorption precautions are taken and connectors are still exhibiting some delamination during SMT assembly, measuring the amount of moisture in the parts to determine the steps required to solder without connector blistering may be required.